Ryzen AI Embedded X188 vs Ryzen 9 4900HS
Contents
Primary details
Comparing processor market type (desktop or notebook), architecture, sales start time and price.
| Place in the ranking | 928 | not rated |
| Place by popularity | not in top-100 | not in top-100 |
| Market segment | Laptop | Desktop processor |
| Series | AMD Renoir (Ryzen 4000 APU) | no data |
| Power efficiency | 12.92 | no data |
| Designer | AMD | AMD |
| Manufacturer | TSMC | TSMC |
| Architecture codename | Renoir (Zen 2) (2020) | Strix Halo (2025−2026) |
| Release date | 7 March 2020 (6 years ago) | 23 July 2026 (less than a year ago) |
Detailed specifications
Basic parameters of Ryzen 9 4900HS and Ryzen AI Embedded X188: number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
| Physical cores | 8 (Octa-Core) | 12 (Dodeca-Core) |
| Threads | 16 | 24 |
| Base clock speed | 3 GHz | 3.2 GHz |
| Boost clock speed | 4.3 GHz | 5 GHz |
| Multiplier | 30 | no data |
| L1 cache | 64 KB (per core) | 80 KB (per core) |
| L2 cache | 512 KB (per core) | 1 MB (per core) |
| L3 cache | 8 MB (shared) | 64 MB (shared) |
| Chip lithography | 7 nm | 4 nm |
| Die size | 156 mm2 | 2x 70.6 mm2 |
| Maximum core temperature | 105 °C | no data |
| Number of transistors | 9,800 million | no data |
| 64 bit support | + | + |
| Windows 11 compatibility | + | no data |
Compatibility
Information on Ryzen 9 4900HS and Ryzen AI Embedded X188 compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
| Number of CPUs in a configuration | 1 | 1 |
| Socket | FP6 | FP11 |
| Power consumption (TDP) | 35 Watt | 55 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by Ryzen 9 4900HS and Ryzen AI Embedded X188. You'll probably need this information if you require some particular technology.
| Instruction set extensions | XFR, FMA3, SSE 4.2, AVX2, SMT | no data |
| AES-NI | + | + |
| AVX | + | + |
| Precision Boost 2 | no data | + |
Virtualization technologies
Virtual machine speed-up technologies supported by Ryzen 9 4900HS and Ryzen AI Embedded X188 are enumerated here.
| AMD-V | + | + |
Memory specs
Types, maximum amount and channel quantity of RAM supported by Ryzen 9 4900HS and Ryzen AI Embedded X188. Depending on the motherboard, higher memory frequencies may be supported.
| Supported memory types | DDR4-4266 | LPDDR5X |
| Maximum memory size | 64 GB | no data |
| Max memory channels | 4 | no data |
| Maximum memory bandwidth | 68.27 GB/s | no data |
Graphics specifications
General parameters of integrated GPUs, if any.
| Integrated graphics card | AMD Radeon RX Vega 8 (Ryzen 4000/5000) ( - 1750 MHz) | AMD Radeon 8050S |
Peripherals
Specifications and connection of peripherals supported by Ryzen 9 4900HS and Ryzen AI Embedded X188.
| PCIe version | 3.0 | 4.0 |
| PCI Express lanes | no data | 16 |
Pros & cons summary
| Integrated graphics card | 8.31 | 39.36 |
| Recency | 7 March 2020 | 23 July 2026 |
| Physical cores | 8 | 12 |
| Threads | 16 | 24 |
| Chip lithography | 7 nm | 4 nm |
| Power consumption (TDP) | 35 Watt | 55 Watt |
Ryzen 9 4900HS has 57% lower power consumption.
Ryzen AI Embedded X188, on the other hand, has 374% faster integrated GPU, an age advantage of 6 years, 50% more physical cores and 50% more threads, and a 75% more advanced lithography process.
We couldn't decide between AMD Ryzen 9 4900HS and AMD Ryzen AI Embedded X188. We've got no test results to judge.
Be aware that Ryzen 9 4900HS is a notebook processor while Ryzen AI Embedded X188 is a desktop one.
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