Celeron B860E vs Ryzen 7 PRO 3700
Contents
Primary details
Comparing processor market type (desktop or notebook), architecture, sales start time and price.
| Place in the ranking | 643 | not rated |
| Place by popularity | not in top-100 | not in top-100 |
| Market segment | Desktop processor | Laptop |
| Series | AMD Ryzen 7 | Intel Celeron |
| Power efficiency | 8.44 | no data |
| Designer | AMD | Intel |
| Manufacturer | TSMC | no data |
| Architecture codename | Matisse (2019−2020) | Sandy Bridge (2011−2013) |
| Release date | 30 September 2019 (6 years ago) | no data |
Detailed specifications
Ryzen 7 PRO 3700 and Celeron B860E basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
| Physical cores | 8 (Octa-Core) | 2 (Dual-core) |
| Threads | 16 | 2 |
| Base clock speed | 3.6 GHz | no data |
| Boost clock speed | 4.4 GHz | 2.1 GHz |
| Bus type | no data | DMI 2.0 |
| Bus rate | no data | 4 × 5 GT/s |
| Multiplier | no data | 21 |
| L1 cache | 64 KB (per core) | 128 KB |
| L2 cache | 512 KB (per core) | 512 KB |
| L3 cache | 32 MB | 2 MB |
| Chip lithography | 7 nm | 32 nm |
| Die size | 74 mm2 | 131 mm2 |
| Maximum case temperature (TCase) | 95 °C | no data |
| Number of transistors | 3,800 million | 504 Million |
| 64 bit support | + | + |
| Windows 11 compatibility | + | - |
| Unlocked multiplier | + | - |
Compatibility
Information on Ryzen 7 PRO 3700 and Celeron B860E compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
| Number of CPUs in a configuration | 1 (Uniprocessor) | 1 (Uniprocessor) |
| Socket | AM4 | no data |
| Power consumption (TDP) | 65 Watt | 35 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by Ryzen 7 PRO 3700 and Celeron B860E. You'll probably need this information if you require some particular technology.
| AES-NI | + | - |
| FMA | - | + |
| AVX | + | - |
| Enhanced SpeedStep (EIST) | no data | + |
| Precision Boost 2 | + | no data |
Virtualization technologies
Virtual machine speed-up technologies supported by Ryzen 7 PRO 3700 and Celeron B860E are enumerated here.
| AMD-V | + | - |
| VT-x | no data | + |
Memory specs
Types, maximum amount and channel quantity of RAM supported by Ryzen 7 PRO 3700 and Celeron B860E. Depending on the motherboard, higher memory frequencies may be supported.
| Supported memory types | DDR4-3200 | no data |
| Maximum memory size | 128 GB | 16 GB |
| Max memory channels | 2 | no data |
| Maximum memory bandwidth | 51.196 GB/s | 21.335 GB/s |
Graphics specifications
General parameters of integrated GPUs, if any.
| Integrated graphics card | N/A | Intel HD Graphics (Sandy Bridge) |
Peripherals
Specifications and connection of peripherals supported by Ryzen 7 PRO 3700 and Celeron B860E.
| PCIe version | 4.0 | no data |
| PCI Express lanes | 24 | no data |
Pros & cons summary
| Physical cores | 8 | 2 |
| Threads | 16 | 2 |
| Chip lithography | 7 nm | 32 nm |
| Power consumption (TDP) | 65 Watt | 35 Watt |
Ryzen 7 PRO 3700 has 300% more physical cores and 700% more threads, and a 357.1% more advanced lithography process.
Celeron B860E, on the other hand, has 85.7% lower power consumption.
We couldn't decide between AMD Ryzen 7 PRO 3700 and Intel Celeron B860E. We've got no test results to judge.
Note that Ryzen 7 PRO 3700 is a desktop processor while Celeron B860E is a notebook one.
Other comparisons
We've compiled a selection of CPU comparisons, ranging from closely matched processors to other comparisons that may be of interest.
