Ryzen AI 9 HX PRO 370 vs Ryzen 3 3100
Aggregate performance score
Ryzen AI 9 HX PRO 370 outperforms Ryzen 3 3100 by a whopping 150% based on our aggregate benchmark results.
Primary details
Comparing Ryzen 3 3100 and Ryzen AI 9 HX PRO 370 processor market type (desktop or notebook), architecture, sales start time and price.
| Place in the ranking | 1015 | 335 |
| Place by popularity | not in top-100 | not in top-100 |
| Cost-effectiveness evaluation | 33.70 | no data |
| Market segment | Desktop processor | Laptop |
| Series | Matisse (Ryzen 3000 Desktop) | Strix Point (Zen 5/5c, Ryzen AI 3/5/7/9) |
| Power efficiency | 10.89 | no data |
| Architecture codename | Matisse (Zen 2) (2019−2020) | Strix Point-HX PRO (Zen 5/5c) (2025) |
| Release date | 24 April 2020 (4 years ago) | 6 January 2025 (less than a year ago) |
| Launch price (MSRP) | $99 | no data |
Cost-effectiveness evaluation
Performance per price, higher is better.
Detailed specifications
Ryzen 3 3100 and Ryzen AI 9 HX PRO 370 basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
| Physical cores | 4 (Quad-Core) | 12 (Dodeca-Core) |
| Threads | 8 | 24 |
| Base clock speed | 3.6 GHz | 2 GHz |
| Boost clock speed | 3.9 GHz | 5.1 GHz |
| Bus rate | no data | 54 MHz |
| L1 cache | 96K (per core) | 80 KB (per core) |
| L2 cache | 512K (per core) | 1 MB (per core) |
| L3 cache | 16 MB (shared) | 16 MB |
| Chip lithography | 7 nm | 4 nm |
| Die size | 74 mm2 | 233 mm2 |
| Maximum case temperature (TCase) | 95 °C | no data |
| Number of transistors | 3,800 million | no data |
| 64 bit support | + | - |
| Windows 11 compatibility | + | no data |
| Unlocked multiplier | + | - |
Compatibility
Information on Ryzen 3 3100 and Ryzen AI 9 HX PRO 370 compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
| Number of CPUs in a configuration | 1 | 1 |
| Socket | AM4 | FP8 |
| Power consumption (TDP) | 65 Watt | 28 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by Ryzen 3 3100 and Ryzen AI 9 HX PRO 370. You'll probably need this information if you require some particular technology.
| Instruction set extensions | MMX, SSE, SSE2, SSE3, SSSE3, SSE4A, SSE4.1, SSE4.2, AVX, AVX2, BMI2, ABM, FMA, ADX, SMEP, SMAP, SMT, CPB, AES-NI, RDRAND, RDSEED, SHA, SME | USB 4, XDNA 2 NPU (50 TOPS), SMT, AES, AVX, AVX2, AVX512, FMA3, MMX+, SHA, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4A |
| AES-NI | + | + |
| FMA | + | - |
| AVX | + | + |
| Precision Boost 2 | + | + |
Virtualization technologies
Virtual machine speed-up technologies supported by Ryzen 3 3100 and Ryzen AI 9 HX PRO 370 are enumerated here.
| AMD-V | + | + |
Memory specs
Types, maximum amount and channel quantity of RAM supported by Ryzen 3 3100 and Ryzen AI 9 HX PRO 370. Depending on the motherboard, higher memory frequencies may be supported.
| Supported memory types | DDR4 | DDR5 |
Graphics specifications
General parameters of integrated GPUs, if any.
| Integrated graphics card | no data | AMD Radeon 890M ( - 2900 MHz) |
Peripherals
Specifications and connection of peripherals supported by Ryzen 3 3100 and Ryzen AI 9 HX PRO 370.
| PCIe version | 4.0 | 4.0 |
| PCI Express lanes | 16 | 16 |
Synthetic benchmark performance
Various benchmark results of the processors in comparison. Overall score is measured in points in 0-100 range, higher is better.
Combined synthetic benchmark score
This is our combined benchmark performance rating.
Passmark
Passmark CPU Mark is a widespread benchmark, consisting of 8 different types of workload, including integer and floating point math, extended instructions, compression, encryption and physics calculation. There is also one separate single-threaded scenario measuring single-core performance.
Pros & cons summary
| Performance score | 7.45 | 18.63 |
| Recency | 24 April 2020 | 6 January 2025 |
| Physical cores | 4 | 12 |
| Threads | 8 | 24 |
| Chip lithography | 7 nm | 4 nm |
| Power consumption (TDP) | 65 Watt | 28 Watt |
Ryzen AI 9 HX PRO 370 has a 150.1% higher aggregate performance score, an age advantage of 4 years, 200% more physical cores and 200% more threads, a 75% more advanced lithography process, and 132.1% lower power consumption.
The Ryzen AI 9 HX PRO 370 is our recommended choice as it beats the Ryzen 3 3100 in performance tests.
Note that Ryzen 3 3100 is a desktop processor while Ryzen AI 9 HX PRO 370 is a notebook one.
Other comparisons
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