Xeon 6979P vs Pentium G3260

Primary details

Comparing Pentium G3260 and Xeon 6979P processor market type (desktop or notebook), architecture, sales start time and price.

Place in the ranking	2270	not rated
Place by popularity	not in top-100	not in top-100
Market segment	Desktop processor	Server
Power efficiency	2.36	no data
Architecture codename	no data	Granite Rapids (2024)
Release date	1 January 2015 (9 years ago)	24 September 2024 (less than a year ago)

Detailed specifications

Pentium G3260 and Xeon 6979P basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.

Physical cores	2 (Dual-core)	120
Threads	2	240
Base clock speed	3.3 GHz	2.1 GHz
Boost clock speed	no data	3.9 GHz
Bus rate	5 GT/s	no data
L1 cache	no data	112 KB (per core)
L2 cache	no data	2 MB (per core)
L3 cache	3 MB	504 MB (shared)
Chip lithography	22 nm	5 nm
Maximum core temperature	72 °C	no data
Maximum case temperature (TCase)	no data	80 °C
64 bit support	+	+
Windows 11 compatibility	-	no data

Compatibility

Information on Pentium G3260 and Xeon 6979P compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.

Number of CPUs in a configuration	1	2
Socket	FCLGA1150	7529
Power consumption (TDP)	53 Watt	500 Watt

Technologies and extensions

Technological solutions and additional instructions supported by Pentium G3260 and Xeon 6979P. You'll probably need this information if you require some particular technology.

Instruction set extensions	Intel® SSE4.1, Intel® SSE4.2	no data
AES-NI	-	+
AVX	-	+
Enhanced SpeedStep (EIST)	+	+
Turbo Boost Technology	-	no data
Hyper-Threading Technology	-	no data
TSX	-	+
Idle States	+	no data
Thermal Monitoring	+	-

Security technologies

Pentium G3260 and Xeon 6979P technologies aimed at improving security, for example, by protecting against hacks.

TXT	-	+
EDB	+	no data
Secure Key	+	no data

Virtualization technologies

Virtual machine speed-up technologies supported by Pentium G3260 and Xeon 6979P are enumerated here.

VT-d	-	+
VT-x	+	+
EPT	+	no data

Memory specs

Types, maximum amount and channel quantity of RAM supported by Pentium G3260 and Xeon 6979P. Depending on the motherboard, higher memory frequencies may be supported.

Supported memory types	DDR3-1333, DDR3L-1333	DDR5
Maximum memory size	32 GB	no data
Max memory channels	2	no data
Maximum memory bandwidth	21.3 GB/s	no data
ECC memory support	+	-

Graphics specifications

General parameters of integrated GPUs, if any.

Integrated graphics card	Intel HD Graphics for 4th Generation Intel Processors	N/A
Max video memory	1.7 GB	no data
Quick Sync Video	+	-
Graphics max frequency	1.1 GHz	no data

Graphics interfaces

Available interfaces and connections of Pentium G3260 and Xeon 6979P integrated GPUs.

Number of displays supported	3	no data
eDP	+	no data
DisplayPort	+	-
HDMI	+	-
DVI	+	no data
VGA	+	no data

Graphics image quality

Maximum display resolutions supported by Pentium G3260 and Xeon 6979P integrated GPUs, including resolutions over different interfaces.

Max resolution over HDMI 1.4	1920x1080@60Hz	no data
Max resolution over eDP	2560x1600@60Hz	no data
Max resolution over DisplayPort	2560x1600@60Hz	no data
Max resolution over VGA	1920x1200@60Hz	no data

Graphics API support

APIs supported by Pentium G3260 and Xeon 6979P integrated GPUs, sometimes API versions are included.

DirectX	11.1/12	no data
OpenGL	4.3	no data

Peripherals

Specifications and connection of peripherals supported by Pentium G3260 and Xeon 6979P.

PCIe version	Up to 3.0	5.0
PCI Express lanes	16	96

Pros & cons summary

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Recency	1 January 2015	24 September 2024
Physical cores	2	120
Threads	2	240
Chip lithography	22 nm	5 nm
Power consumption (TDP)	53 Watt	500 Watt

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