i3-7100E vs EPYC 9455P
Contents
Primary details
Comparing processor market type (desktop or notebook), architecture, sales start time and price.
| Place in the ranking | 23 | not rated |
| Place by popularity | not in top-100 | not in top-100 |
| Cost-effectiveness evaluation | 11.73 | no data |
| Market segment | Server | Laptop |
| Series | no data | Intel Core i3 |
| Power efficiency | 9.39 | no data |
| Designer | AMD | Intel |
| Manufacturer | TSMC | no data |
| Architecture codename | Turin (2024) | Kaby Lake (2016−2019) |
| Release date | 10 October 2024 (1 year ago) | 3 January 2017 (9 years ago) |
| Launch price (MSRP) | $4,819 | $225 |
Cost-effectiveness evaluation
Performance per price, higher is better.
Performance to price scatter graph
Detailed specifications
EPYC 9455P and Core i3-7100E basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
| Physical cores | 48 (Octatetraconta-Core) | 2 (Dual-core) |
| Threads | 96 | 4 |
| Base clock speed | 3.15 GHz | no data |
| Boost clock speed | 4.4 GHz | 2.9 GHz |
| Bus type | no data | DMI 3.0 |
| Bus rate | no data | 8 GT/s |
| Multiplier | no data | 29 |
| L1 cache | 80 KB (per core) | 128 KB |
| L2 cache | 1 MB (per core) | 512 KB |
| L3 cache | 256 MB (shared) | 3 MB |
| Chip lithography | 4 nm | 14 nm |
| Die size | 8x 70.6 mm2 | no data |
| Number of transistors | 66,520 million | no data |
| 64 bit support | + | + |
| Windows 11 compatibility | no data | - |
Compatibility
Information on EPYC 9455P and Core i3-7100E compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
| Number of CPUs in a configuration | 1 | 1 (Uniprocessor) |
| Socket | SP5 | no data |
| Power consumption (TDP) | 300 Watt | 35 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by EPYC 9455P and Core i3-7100E. You'll probably need this information if you require some particular technology.
| AES-NI | + | + |
| AVX | + | + |
| Enhanced SpeedStep (EIST) | no data | + |
| Precision Boost 2 | + | no data |
Virtualization technologies
Virtual machine speed-up technologies supported by EPYC 9455P and Core i3-7100E are enumerated here.
| AMD-V | + | - |
| VT-d | no data | + |
| VT-x | no data | + |
Memory specs
Types, maximum amount and channel quantity of RAM supported by EPYC 9455P and Core i3-7100E. Depending on the motherboard, higher memory frequencies may be supported.
| Supported memory types | DDR5 | DDR3L-1600 |
| Maximum memory size | no data | 64 GB |
| Max memory channels | no data | 2 |
| Maximum memory bandwidth | no data | 34.134 GB/s |
| ECC memory support | - | + |
Graphics specifications
General parameters of integrated GPUs, if any.
| Integrated graphics card | N/A | Intel HD Graphics 630 |
Peripherals
Specifications and connection of peripherals supported by EPYC 9455P and Core i3-7100E.
| PCIe version | 5.0 | 3.0 |
| PCI Express lanes | 128 | 16 |
Pros & cons summary
| Recency | 10 October 2024 | 3 January 2017 |
| Physical cores | 48 | 2 |
| Threads | 96 | 4 |
| Chip lithography | 4 nm | 14 nm |
| Power consumption (TDP) | 300 Watt | 35 Watt |
EPYC 9455P has an age advantage of 7 years, 2300% more physical cores and 2300% more threads, and a 250% more advanced lithography process.
i3-7100E, on the other hand, has 757.1% lower power consumption.
We couldn't decide between AMD EPYC 9455P and Intel Core i3-7100E. We've got no test results to judge.
Be aware that EPYC 9455P is a server/workstation processor while Core i3-7100E is a notebook one.
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