i3-1215U (IPU) vs EPYC 8434P
Contents
Primary details
Comparing processor market type (desktop or notebook), architecture, sales start time and price.
| Place in the ranking | 88 | not rated |
| Place by popularity | not in top-100 | not in top-100 |
| Cost-effectiveness evaluation | 14.36 | no data |
| Market segment | Server | Laptop |
| Power efficiency | 7.99 | no data |
| Designer | AMD | Intel |
| Manufacturer | TSMC | Intel |
| Architecture codename | Siena (2023−2024) | Alder Lake-U (2022) |
| Release date | 18 September 2023 (2 years ago) | 23 February 2022 (3 years ago) |
| Launch price (MSRP) | $2,700 | no data |
Cost-effectiveness evaluation
Performance per price, higher is better.
Performance to price scatter graph
Detailed specifications
EPYC 8434P and Core i3-1215U (IPU) basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
| Physical cores | 48 (Octatetraconta-Core) | 6 (Hexa-Core) |
| Threads | 96 | 8 |
| Base clock speed | 2.5 GHz | 1.2 GHz |
| Boost clock speed | 3.1 GHz | 4.4 GHz |
| L1 cache | 64 KB (per core) | 80K (per core) |
| L2 cache | 1 MB (per core) | 1.25 MB (per core) |
| L3 cache | 128 MB (shared) | 10 MB (shared) |
| Chip lithography | 5 nm | 10 nm |
| Die size | 4x 73 mm2 | no data |
| Maximum case temperature (TCase) | 75 °C | no data |
| Number of transistors | 35,500 million | no data |
| 64 bit support | + | + |
Compatibility
Information on EPYC 8434P and Core i3-1215U (IPU) compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
| Number of CPUs in a configuration | 1 | 1 |
| Socket | SP6 | Intel BGA 1744 |
| Power consumption (TDP) | 200 Watt | 15 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by EPYC 8434P and Core i3-1215U (IPU). You'll probably need this information if you require some particular technology.
| AES-NI | + | + |
| AVX | + | + |
| Enhanced SpeedStep (EIST) | no data | + |
| TSX | - | + |
| Precision Boost 2 | + | no data |
Security technologies
EPYC 8434P and Core i3-1215U (IPU) technologies aimed at improving security, for example, by protecting against hacks.
| TXT | no data | + |
Virtualization technologies
Virtual machine speed-up technologies supported by EPYC 8434P and Core i3-1215U (IPU) are enumerated here.
| AMD-V | + | - |
| VT-d | no data | + |
| VT-x | no data | + |
Memory specs
Types, maximum amount and channel quantity of RAM supported by EPYC 8434P and Core i3-1215U (IPU). Depending on the motherboard, higher memory frequencies may be supported.
| Supported memory types | DDR5 | DDR4, DDR5 Dual-channel |
Graphics specifications
General parameters of integrated GPUs, if any.
| Integrated graphics card | N/A | Intel UHD Graphics 64EU |
Peripherals
Specifications and connection of peripherals supported by EPYC 8434P and Core i3-1215U (IPU).
| PCIe version | 5.0 | 4.0 |
| PCI Express lanes | 96 | 20 |
Pros & cons summary
| Recency | 18 September 2023 | 23 February 2022 |
| Physical cores | 48 | 6 |
| Threads | 96 | 8 |
| Chip lithography | 5 nm | 10 nm |
| Power consumption (TDP) | 200 Watt | 15 Watt |
EPYC 8434P has an age advantage of 1 year, 700% more physical cores and 1100% more threads, and a 100% more advanced lithography process.
i3-1215U (IPU), on the other hand, has 1233.3% lower power consumption.
We couldn't decide between AMD EPYC 8434P and Intel Core i3-1215U (IPU). We've got no test results to judge.
Be aware that EPYC 8434P is a server/workstation processor while Core i3-1215U (IPU) is a notebook one.
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