i3-2397M vs EPYC 8224P
Contents
Primary details
Comparing processor market type (desktop or notebook), architecture, sales start time and price.
| Place in the ranking | 241 | not rated |
| Place by popularity | not in top-100 | not in top-100 |
| Cost-effectiveness evaluation | 30.70 | no data |
| Market segment | Server | Laptop |
| Series | no data | Intel Core i3 |
| Power efficiency | 17.27 | no data |
| Designer | AMD | Intel |
| Manufacturer | TSMC | no data |
| Architecture codename | Siena (2023−2024) | Sandy Bridge (2011−2013) |
| Release date | 18 September 2023 (2 years ago) | no data |
| Launch price (MSRP) | $855 | no data |
Cost-effectiveness evaluation
Performance per price, higher is better.
Performance to price scatter graph
Detailed specifications
EPYC 8224P and Core i3-2397M basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
| Physical cores | 24 (Tetracosa-Core) | 2 (Dual-core) |
| Threads | 48 | 4 |
| Base clock speed | 2.55 GHz | no data |
| Boost clock speed | 3 GHz | 1.5 GHz |
| Bus type | no data | DMI 2.0 |
| Bus rate | no data | 4 × 5 GT/s |
| Multiplier | no data | 15 |
| L1 cache | 64 KB (per core) | 128 KB |
| L2 cache | 1 MB (per core) | 512 KB |
| L3 cache | 64 MB (shared) | 3 MB |
| Chip lithography | 5 nm | 32 nm |
| Die size | 2x 73 mm2 | 149 mm2 |
| Maximum case temperature (TCase) | 75 °C | no data |
| Number of transistors | 17,750 million | 624 Million |
| 64 bit support | + | + |
| Windows 11 compatibility | no data | - |
Compatibility
Information on EPYC 8224P and Core i3-2397M compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
| Number of CPUs in a configuration | 1 | 1 (Uniprocessor) |
| Socket | SP6 | no data |
| Power consumption (TDP) | 160 Watt | 17 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by EPYC 8224P and Core i3-2397M. You'll probably need this information if you require some particular technology.
| AES-NI | + | - |
| FMA | - | + |
| AVX | + | + |
| Enhanced SpeedStep (EIST) | no data | + |
| Precision Boost 2 | + | no data |
Virtualization technologies
Virtual machine speed-up technologies supported by EPYC 8224P and Core i3-2397M are enumerated here.
| AMD-V | + | - |
| VT-x | no data | + |
Memory specs
Types, maximum amount and channel quantity of RAM supported by EPYC 8224P and Core i3-2397M. Depending on the motherboard, higher memory frequencies may be supported.
| Supported memory types | DDR5 | DDR3-1333 |
| Maximum memory size | no data | 16 GB |
| Max memory channels | no data | 2 |
| Maximum memory bandwidth | no data | 21.335 GB/s |
Graphics specifications
General parameters of integrated GPUs, if any.
| Integrated graphics card | N/A | Intel HD Graphics 3000 |
Peripherals
Specifications and connection of peripherals supported by EPYC 8224P and Core i3-2397M.
| PCIe version | 5.0 | no data |
| PCI Express lanes | 96 | no data |
Pros & cons summary
| Physical cores | 24 | 2 |
| Threads | 48 | 4 |
| Chip lithography | 5 nm | 32 nm |
| Power consumption (TDP) | 160 Watt | 17 Watt |
EPYC 8224P has 1100% more physical cores and 1100% more threads, and a 540% more advanced lithography process.
i3-2397M, on the other hand, has 841.2% lower power consumption.
We couldn't decide between AMD EPYC 8224P and Intel Core i3-2397M. We've got no test results to judge.
Be aware that EPYC 8224P is a server/workstation processor while Core i3-2397M is a notebook one.
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