i7-620LE vs E2-9000
Contents
Primary details
Comparing processor market type (desktop or notebook), architecture, sales start time and price.
| Place in the ranking | 3093 | not rated |
| Place by popularity | not in top-100 | not in top-100 |
| Market segment | Laptop | Laptop |
| Series | Bristol Ridge | Intel Core i7 |
| Designer | AMD | Intel |
| Manufacturer | no data | Intel |
| Architecture codename | Stoney Ridge (2016−2019) | Arrandale (2010−2011) |
| Release date | 1 June 2016 (9 years ago) | 7 January 2010 (15 years ago) |
| Launch price (MSRP) | no data | $247 |
Detailed specifications
E2-9000 and Core i7-620LE basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
| Physical cores | 2 (Dual-core) | 2 (Dual-core) |
| Threads | 2 | 4 |
| Base clock speed | 1.8 GHz | 2 GHz |
| Boost clock speed | 2.2 GHz | 2.8 GHz |
| Bus type | no data | DMI 1.0 |
| Bus rate | no data | 1 × 2.5 GT/s |
| Multiplier | no data | 15 |
| L1 cache | no data | 64 KB (per core) |
| L2 cache | 1 MB | 256 KB (per core) |
| L3 cache | no data | 4 MB (shared) |
| Chip lithography | 28 nm | 32 nm |
| Die size | 124.5 mm2 | 81 mm2 |
| Maximum core temperature | 90 °C | no data |
| Number of transistors | 1200 Million | 382 million |
| 64 bit support | + | + |
| Windows 11 compatibility | - | - |
Compatibility
Information on E2-9000 and Core i7-620LE compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
| Number of CPUs in a configuration | no data | 1 (Uniprocessor) |
| Socket | BGA | Intel BGA 1288 |
| Power consumption (TDP) | 1 MB | 25 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by E2-9000 and Core i7-620LE. You'll probably need this information if you require some particular technology.
| Instruction set extensions | Virtualization, | no data |
| AES-NI | - | + |
| FMA | - | + |
| vPro | no data | + |
| Enhanced SpeedStep (EIST) | no data | + |
Security technologies
E2-9000 and Core i7-620LE technologies aimed at improving security, for example, by protecting against hacks.
| TXT | no data | + |
Virtualization technologies
Virtual machine speed-up technologies supported by E2-9000 and Core i7-620LE are enumerated here.
| AMD-V | + | - |
| VT-d | no data | + |
| VT-x | no data | + |
Memory specs
Types, maximum amount and channel quantity of RAM supported by E2-9000 and Core i7-620LE. Depending on the motherboard, higher memory frequencies may be supported.
| Supported memory types | DDR4 | DDR3-1066 |
| Maximum memory size | no data | 8 GB |
| Max memory channels | no data | 2 |
| Maximum memory bandwidth | no data | 17.051 GB/s |
| ECC memory support | - | + |
Graphics specifications
General parameters of integrated GPUs, if any.
| Integrated graphics card | AMD Radeon R2 (Stoney Ridge) ( - 600 MHz) | Intel HD Graphics (Ironlake) |
Peripherals
Specifications and connection of peripherals supported by E2-9000 and Core i7-620LE.
| PCIe version | no data | 2.0 |
| PCI Express lanes | no data | 16 |
Pros & cons summary
| Integrated graphics card | 0.95 | 0.72 |
| Recency | 1 June 2016 | 7 January 2010 |
| Threads | 2 | 4 |
| Chip lithography | 28 nm | 32 nm |
| Power consumption (TDP) | 1 Watt | 25 Watt |
E2-9000 has 31.9% faster integrated GPU, an age advantage of 6 years, a 14.3% more advanced lithography process, and 2400% lower power consumption.
i7-620LE, on the other hand, has 100% more threads.
We couldn't decide between AMD E2-9000 and Intel Core i7-620LE. We've got no test results to judge.
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