i3-10100F vs i7-2629M

Primary details

Comparing Core i7-2629M and Core i3-10100F processor market type (desktop or notebook), architecture, sales start time and price.

Place in the ranking	not rated	1161
Place by popularity	not in top-100	20
Cost-effectiveness evaluation	no data	20.97
Market segment	Laptop	Desktop processor
Series	Intel Core i7	no data
Power efficiency	no data	8.02
Architecture codename	Sandy Bridge (2011−2013)	Comet Lake (2020)
Release date	3 January 2011 (13 years ago)	12 October 2020 (4 years ago)
Launch price (MSRP)	$311	$122

Cost-effectiveness evaluation

Performance per price, higher is better.

Detailed specifications

Core i7-2629M and Core i3-10100F basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.

Physical cores	2 (Dual-core)	4 (Quad-Core)
Threads	4	8
Base clock speed	2.1 GHz	3.6 GHz
Boost clock speed	3 GHz	4.3 GHz
Bus type	DMI 2.0	no data
Bus rate	4 × 5 GT/s	8 GT/s
Multiplier	21	no data
L1 cache	128 KB	256 KB
L2 cache	512 KB	1 MB
L3 cache	4 MB	6 MB
Chip lithography	32 nm	14 nm
Die size	149 mm2	126 mm2
Maximum core temperature	100 °C	100 °C
Number of transistors	624 Million	no data
64 bit support	+	+
Windows 11 compatibility	-	+

Compatibility

Information on Core i7-2629M and Core i3-10100F compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.

Number of CPUs in a configuration	1 (Uniprocessor)	1
Socket	FCBGA1023	FCLGA1200
Power consumption (TDP)	25 Watt	65 Watt

Technologies and extensions

Technological solutions and additional instructions supported by Core i7-2629M and Core i3-10100F. You'll probably need this information if you require some particular technology.

Instruction set extensions	Intel® AVX	Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2
AES-NI	+	+
FMA	+	-
AVX	+	+
Enhanced SpeedStep (EIST)	+	+
My WiFi	+	no data
Turbo Boost Technology	+	2.0
Hyper-Threading Technology	+	+
Idle States	+	+
Thermal Monitoring	+	+
Flex Memory Access	+	no data
Demand Based Switching	-	no data
Turbo Boost Max 3.0	no data	-
FDI	+	no data
Fast Memory Access	+	no data

Security technologies

Core i7-2629M and Core i3-10100F technologies aimed at improving security, for example, by protecting against hacks.

TXT	+	-
EDB	+	+
Secure Key	no data	+
Identity Protection	+	+
SGX	no data	Yes with Intel® ME
OS Guard	no data	+
Anti-Theft	+	no data

Virtualization technologies

Virtual machine speed-up technologies supported by Core i7-2629M and Core i3-10100F are enumerated here.

AMD-V	+	-
VT-d	+	+
VT-x	+	+
EPT	+	+

Memory specs

Types, maximum amount and channel quantity of RAM supported by Core i7-2629M and Core i3-10100F. Depending on the motherboard, higher memory frequencies may be supported.

Supported memory types	DDR3	DDR4
Maximum memory size	8.01 GB	128 GB
Max memory channels	2	2
Maximum memory bandwidth	21.335 GB/s	41.6 GB/s

Graphics specifications

General parameters of integrated GPUs, if any.

Integrated graphics card	Intel HD Graphics 3000	no data
Quick Sync Video	+	-
Clear Video HD	+	no data
Graphics max frequency	1.1 GHz	no data
InTru 3D	+	no data

Graphics interfaces

Available interfaces and connections of Core i7-2629M and Core i3-10100F integrated GPUs.

Number of displays supported	2	no data
eDP	+	no data
DisplayPort	+	-
HDMI	+	-
SDVO	+	no data
CRT	+	no data

Peripherals

Specifications and connection of peripherals supported by Core i7-2629M and Core i3-10100F.

PCIe version	2.0	3.0
PCI Express lanes	16	16

Pros & cons summary

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Recency	3 January 2011	12 October 2020
Physical cores	2	4
Threads	4	8
Chip lithography	32 nm	14 nm
Power consumption (TDP)	25 Watt	65 Watt

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