Ryzen AI 9 HX 370 vs i7-13700F
Aggregate performance score
Core i7-13700F outperforms Ryzen AI 9 HX 370 by a moderate 10% based on our aggregate benchmark results.
Primary details
Comparing Core i7-13700F and Ryzen AI 9 HX 370 processor market type (desktop or notebook), architecture, sales start time and price.
| Place in the ranking | 208 | 237 |
| Place by popularity | not in top-100 | not in top-100 |
| Cost-effectiveness evaluation | 57.16 | no data |
| Market segment | Desktop processor | Laptop |
| Power efficiency | 35.71 | 75.32 |
| Architecture codename | Raptor Lake-S (2023−2024) | Strix Point (2024) |
| Release date | 4 January 2023 (1 year ago) | July 2024 (recently) |
| Launch price (MSRP) | $359 | no data |
Cost-effectiveness evaluation
Performance per price, higher is better.
Detailed specifications
Core i7-13700F and Ryzen AI 9 HX 370 basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
| Physical cores | 16 (Hexadeca-Core) | 12 (Dodeca-Core) |
| Threads | 24 | 24 |
| Base clock speed | 2.1 GHz | 2 GHz |
| Boost clock speed | 5.2 GHz | 5.1 GHz |
| Bus rate | no data | 54 MHz |
| L1 cache | 80K (per core) | 80 KB (per core) |
| L2 cache | 2 MB (per core) | 1 MB (per core) |
| L3 cache | 30 MB (shared) | 24 MB (shared) |
| Chip lithography | Intel 7 nm | 4 nm |
| Die size | 257 mm2 | no data |
| Maximum core temperature | 100 °C | 100 °C |
| Maximum case temperature (TCase) | 72 °C | no data |
| 64 bit support | + | + |
| Windows 11 compatibility | + | no data |
Compatibility
Information on Core i7-13700F and Ryzen AI 9 HX 370 compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
| Number of CPUs in a configuration | 1 | 1 |
| Socket | FCLGA1700 | FP8 |
| Power consumption (TDP) | 65 Watt | 28 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by Core i7-13700F and Ryzen AI 9 HX 370. You'll probably need this information if you require some particular technology.
| Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 | USB 4, XDNA 2 NPU (50 TOPS), SMT, AES, AVX, AVX2, AVX512, FMA3, MMX (+), SHA, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4A |
| AES-NI | + | + |
| AVX | + | + |
| Enhanced SpeedStep (EIST) | + | no data |
| Speed Shift | + | no data |
| Turbo Boost Technology | 2.0 | no data |
| Hyper-Threading Technology | + | no data |
| TSX | + | - |
| Idle States | + | no data |
| Thermal Monitoring | + | - |
| Turbo Boost Max 3.0 | + | no data |
| Precision Boost 2 | no data | + |
| Deep Learning Boost | + | - |
Security technologies
Core i7-13700F and Ryzen AI 9 HX 370 technologies aimed at improving security, for example, by protecting against hacks.
| TXT | + | no data |
| EDB | + | no data |
| Secure Key | + | no data |
| OS Guard | + | no data |
Virtualization technologies
Virtual machine speed-up technologies supported by Core i7-13700F and Ryzen AI 9 HX 370 are enumerated here.
| AMD-V | - | + |
| VT-d | + | no data |
| VT-x | + | no data |
| EPT | + | no data |
Memory specs
Types, maximum amount and channel quantity of RAM supported by Core i7-13700F and Ryzen AI 9 HX 370. Depending on the motherboard, higher memory frequencies may be supported.
| Supported memory types | DDR5-5600, DDR4-3200 | DDR5 |
| Maximum memory size | 192 GB | no data |
| Max memory channels | 2 | no data |
| Maximum memory bandwidth | 89.6 GB/s | no data |
Graphics specifications
General parameters of integrated GPUs, if any.
| Integrated graphics card | no data | AMD Radeon 890M |
Peripherals
Specifications and connection of peripherals supported by Core i7-13700F and Ryzen AI 9 HX 370.
| PCIe version | 5.0 and 4.0 | 4.0 |
| PCI Express lanes | 16 | 16 |
Synthetic benchmark performance
Various benchmark results of the processors in comparison. Overall score is measured in points in 0-100 range, higher is better.
Combined synthetic benchmark score
This is our combined benchmark performance rating. We are regularly improving our combining algorithms, but if you find some perceived inconsistencies, feel free to speak up in comments section, we usually fix problems quickly.
Passmark
Passmark CPU Mark is a widespread benchmark, consisting of 8 different types of workload, including integer and floating point math, extended instructions, compression, encryption and physics calculation. There is also one separate single-threaded scenario measuring single-core performance.
Pros & cons summary
| Performance score | 24.54 | 22.30 |
| Physical cores | 16 | 12 |
| Power consumption (TDP) | 65 Watt | 28 Watt |
i7-13700F has a 10% higher aggregate performance score, and 33.3% more physical cores.
Ryzen AI 9 HX 370, on the other hand, has 132.1% lower power consumption.
The Core i7-13700F is our recommended choice as it beats the Ryzen AI 9 HX 370 in performance tests.
Note that Core i7-13700F is a desktop processor while Ryzen AI 9 HX 370 is a notebook one.
Should you still have questions on choice between Core i7-13700F and Ryzen AI 9 HX 370, ask them in Comments section, and we shall answer.
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