EPYC 9335 vs i3-4100M

Primary details

Comparing Core i3-4100M and EPYC 9335 processor market type (desktop or notebook), architecture, sales start time and price.

Place in the ranking	2110	not rated
Place by popularity	not in top-100	not in top-100
Market segment	Laptop	Server
Series	Intel Core i3	no data
Power efficiency	4.07	no data
Architecture codename	Haswell (2013−2015)	Turin (2024)
Release date	4 June 2013 (11 years ago)	10 October 2024 (less than a year ago)
Launch price (MSRP)	$225	$3,178

Detailed specifications

Core i3-4100M and EPYC 9335 basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.

Physical cores	2 (Dual-core)	32 (Dotriaconta-Core)
Threads	4	64
Base clock speed	2.5 GHz	3 GHz
Boost clock speed	2.5 GHz	4.4 GHz
Bus rate	5 GT/s	no data
L1 cache	128 KB	80 KB (per core)
L2 cache	512 KB	1 MB (per core)
L3 cache	3 MB	128 MB (shared)
Chip lithography	22 nm	4 nm
Die size	130 mm2	4x 70.6 mm2
Maximum core temperature	100 °C	no data
Number of transistors	960 Million	33,260 million
64 bit support	+	+
Windows 11 compatibility	-	no data

Compatibility

Information on Core i3-4100M and EPYC 9335 compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.

Number of CPUs in a configuration	1	2
Socket	FCPGA946	SP5
Power consumption (TDP)	37 Watt	210 Watt

Technologies and extensions

Technological solutions and additional instructions supported by Core i3-4100M and EPYC 9335. You'll probably need this information if you require some particular technology.

Instruction set extensions	Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2	no data
AES-NI	+	+
AVX	+	+
Enhanced SpeedStep (EIST)	+	no data
Turbo Boost Technology	-	no data
Hyper-Threading Technology	+	no data
Thermal Monitoring	+	-
Precision Boost 2	no data	+

Security technologies

Core i3-4100M and EPYC 9335 technologies aimed at improving security, for example, by protecting against hacks.

TXT	-	no data
EDB	+	no data
Secure Key	+	no data
Identity Protection	+	-
Anti-Theft	+	no data

Virtualization technologies

Virtual machine speed-up technologies supported by Core i3-4100M and EPYC 9335 are enumerated here.

AMD-V	+	+
VT-d	-	no data
VT-x	+	no data
EPT	+	no data

Memory specs

Types, maximum amount and channel quantity of RAM supported by Core i3-4100M and EPYC 9335. Depending on the motherboard, higher memory frequencies may be supported.

Supported memory types	DDR3	DDR5
Maximum memory size	32 GB	no data
Max memory channels	2	no data
Maximum memory bandwidth	25.6 GB/s	no data

Graphics specifications

General parameters of integrated GPUs, if any.

Integrated graphics card	Intel HD Graphics 4600	N/A
Max video memory	2 GB	no data
Quick Sync Video	+	-
Graphics max frequency	1.1 GHz	no data
InTru 3D	+	no data

Graphics interfaces

Available interfaces and connections of Core i3-4100M and EPYC 9335 integrated GPUs.

Number of displays supported	3	no data
eDP	+	no data
DisplayPort	+	-
HDMI	+	-
VGA	+	no data

Graphics image quality

Maximum display resolutions supported by Core i3-4100M and EPYC 9335 integrated GPUs, including resolutions over different interfaces.

Max resolution over HDMI 1.4	3840x2160@60Hz	no data
Max resolution over DisplayPort	3840x2160@60Hz	no data
Max resolution over VGA	2880x1800@60Hz	no data

Graphics API support

APIs supported by Core i3-4100M and EPYC 9335 integrated GPUs, sometimes API versions are included.

DirectX	11.2/12	no data
OpenGL	4.3	no data

Peripherals

Specifications and connection of peripherals supported by Core i3-4100M and EPYC 9335.

PCIe version	2.0	5.0
PCI Express lanes	16	128

Pros & cons summary

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Recency	4 June 2013	10 October 2024
Physical cores	2	32
Threads	4	64
Chip lithography	22 nm	4 nm
Power consumption (TDP)	37 Watt	210 Watt

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