Ryzen Embedded V1807B vs i3-350M
Aggregate performance score
Ryzen Embedded V1807B outperforms Core i3-350M by a whopping 691% based on our aggregate benchmark results.
Primary details
Comparing Core i3-350M and Ryzen Embedded V1807B processor market type (desktop or notebook), architecture, sales start time and price.
Place in the ranking | 2716 | 1160 |
Place by popularity | not in top-100 | not in top-100 |
Market segment | Laptop | Desktop processor |
Series | Intel Core i3 | AMD Ryzen Embedded |
Power efficiency | 1.84 | 11.31 |
Architecture codename | Arrandale (2010−2011) | Zen (2017−2020) |
Release date | 7 January 2010 (14 years ago) | 21 February 2018 (6 years ago) |
Launch price (MSRP) | $130 | no data |
Detailed specifications
Core i3-350M and Ryzen Embedded V1807B basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
Physical cores | 2 (Dual-core) | 4 (Quad-Core) |
Threads | 4 | 8 |
Base clock speed | 2.26 GHz | 3.35 GHz |
Boost clock speed | 0.27 GHz | 3.8 GHz |
Bus type | DMI 1.0 | no data |
Bus rate | 1 × 2.5 GT/s | no data |
Multiplier | 17 | 33.5 |
L1 cache | 64K (per core) | 128K (per core) |
L2 cache | 256K (per core) | 512K (per core) |
L3 cache | 3 MB (shared) | 2 MB (shared) |
Chip lithography | 32 nm | 14 nm |
Die size | 81+114 mm2 | 210 mm2 |
Maximum core temperature | 90 °C for rPGA, 105 °C for BGA | no data |
Number of transistors | 382+177 Million | 4,950 million |
64 bit support | + | + |
Windows 11 compatibility | - | - |
Compatibility
Information on Core i3-350M and Ryzen Embedded V1807B compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
Number of CPUs in a configuration | 1 (Uniprocessor) | 1 (Uniprocessor) |
Socket | BGA1288,PGA988 | FP5 |
Power consumption (TDP) | 35 Watt | 45 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by Core i3-350M and Ryzen Embedded V1807B. You'll probably need this information if you require some particular technology.
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2 | no data |
AES-NI | - | + |
FMA | + | - |
AVX | - | + |
Enhanced SpeedStep (EIST) | + | no data |
Turbo Boost Technology | - | no data |
Hyper-Threading Technology | + | no data |
Idle States | + | no data |
Thermal Monitoring | + | - |
Flex Memory Access | + | no data |
PAE | 36 Bit | no data |
FDI | + | no data |
Fast Memory Access | + | no data |
Precision Boost 2 | no data | + |
Security technologies
Core i3-350M and Ryzen Embedded V1807B technologies aimed at improving security, for example, by protecting against hacks.
TXT | - | no data |
EDB | + | no data |
Virtualization technologies
Virtual machine speed-up technologies supported by Core i3-350M and Ryzen Embedded V1807B are enumerated here.
AMD-V | - | + |
VT-d | - | no data |
VT-x | + | no data |
EPT | + | no data |
Memory specs
Types, maximum amount and channel quantity of RAM supported by Core i3-350M and Ryzen Embedded V1807B. Depending on the motherboard, higher memory frequencies may be supported.
Supported memory types | DDR3 | DDR4 Dual-channel |
Maximum memory size | 8 GB | 32 GB |
Max memory channels | 2 | 2 |
Maximum memory bandwidth | 17.051 GB/s | 51.196 GB/s |
Graphics specifications
General parameters of integrated GPUs, if any.
Integrated graphics card | Intel® HD Graphics for Previous Generation Intel® Processors | AMD Radeon RX Vega 11 |
Clear Video | + | no data |
Clear Video HD | + | no data |
Graphics max frequency | 667 MHz | no data |
Graphics interfaces
Available interfaces and connections of Core i3-350M and Ryzen Embedded V1807B integrated GPUs.
Number of displays supported | 2 | no data |
Peripherals
Specifications and connection of peripherals supported by Core i3-350M and Ryzen Embedded V1807B.
PCIe version | 2.0 | no data |
PCI Express lanes | 16 | no data |
Synthetic benchmark performance
Various benchmark results of the processors in comparison. Overall score is measured in points in 0-100 range, higher is better.
Combined synthetic benchmark score
This is our combined benchmark performance rating. We are regularly improving our combining algorithms, but if you find some perceived inconsistencies, feel free to speak up in comments section, we usually fix problems quickly.
Passmark
Passmark CPU Mark is a widespread benchmark, consisting of 8 different types of workload, including integer and floating point math, extended instructions, compression, encryption and physics calculation. There is also one separate single-threaded scenario measuring single-core performance.
Pros & cons summary
Performance score | 0.68 | 5.38 |
Recency | 7 January 2010 | 21 February 2018 |
Physical cores | 2 | 4 |
Threads | 4 | 8 |
Chip lithography | 32 nm | 14 nm |
Power consumption (TDP) | 35 Watt | 45 Watt |
i3-350M has 28.6% lower power consumption.
Ryzen Embedded V1807B, on the other hand, has a 691.2% higher aggregate performance score, an age advantage of 8 years, 100% more physical cores and 100% more threads, and a 128.6% more advanced lithography process.
The Ryzen Embedded V1807B is our recommended choice as it beats the Core i3-350M in performance tests.
Be aware that Core i3-350M is a notebook processor while Ryzen Embedded V1807B is a desktop one.
Should you still have questions on choice between Core i3-350M and Ryzen Embedded V1807B, ask them in Comments section, and we shall answer.
Similar processor comparisons
We picked several similar comparisons of processors in the same market segment and performance relatively close to those reviewed on this page.