Xeon Gold 5318S vs Core i3-3120M

Primary details

Comparing Core i3-3120M and Xeon Gold 5318S processor market type (desktop or notebook), architecture, sales start time and price.

Place in performance ranking	2310	not rated
Place by popularity	not in top-100	not in top-100
Market segment	Laptop	Server
Series	Intel Core i3	no data
Architecture codename	Ivy Bridge (2012−2013)	Ice Lake-SP (2021)
Release date	30 September 2012 (11 years ago)	6 April 2021 (3 years ago)
Launch price (MSRP)	$160	no data
Current price	$206 (1.3x MSRP)	$3998

Detailed specifications

Core i3-3120M and Xeon Gold 5318S basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.

Physical cores	2 (Dual-core)	24 (Tetracosa-Core)
Threads	4	48
Base clock speed	2.5 GHz	2.1 GHz
Boost clock speed	2.5 GHz	3.4 GHz
L1 cache	64K (per core)	64K (per core)
L2 cache	256K (per core)	1 MB (per core)
L3 cache	3 MB (shared)	36 MB (shared)
Chip lithography	22 nm	10 nm
Die size	118 mm2	no data
Maximum core temperature	90C (PGA); 105C (BGA)	87 °C
Maximum case temperature (TCase)	no data	87 °C
64 bit support	+	+
Windows 11 compatibility	-	+
Unlocked multiplier	No	No

Compatibility

Information on Core i3-3120M and Xeon Gold 5318S compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.

Number of CPUs in a configuration	1	2
Socket	FCBGA1023,FCPGA988	FCLGA4189
Power consumption (TDP)	35 Watt	165 Watt

Technologies and extensions

Technological solutions and additional instructions supported by Core i3-3120M and Xeon Gold 5318S. You'll probably need this information if you require some particular technology.

Instruction set extensions	Intel® AVX	Intel® SSE4.2, Intel® AVX, Intel® AVX2, Intel® AVX-512
AES-NI	-	+
AVX	+	+
vPro	no data	+
Enhanced SpeedStep (EIST)	+	+
Speed Shift	no data	+
My WiFi	+	no data
Turbo Boost Technology	-	2.0
Hyper-Threading Technology	+	+
TSX	no data	+
Idle States	+	no data
Thermal Monitoring	+	no data
Flex Memory Access	+	no data
Demand Based Switching	-	no data
FDI	+	no data
Fast Memory Access	+	no data
Status	Discontinued	Launched

Security technologies

Core i3-3120M and Xeon Gold 5318S technologies aimed at improving security, for example, by protecting against hacks.

TXT	-	+
EDB	+	+
Identity Protection	+	no data
SGX	no data	Yes with Intel® SPS
Anti-Theft	+	no data

Virtualization technologies

Virtual machine speed-up technologies supported by Core i3-3120M and Xeon Gold 5318S are enumerated here.

AMD-V	+	no data
VT-d	-	+
VT-x	+	+
EPT	+	+

Memory specs

Types, maximum amount and channel quantity of RAM supported by Core i3-3120M and Xeon Gold 5318S. Depending on the motherboard, higher memory frequencies may be supported.

Supported memory types	DDR3	DDR4-2933
Maximum memory size	32 GB	6 TB
Max memory channels	2	8
Maximum memory bandwidth	25.6 GB/s	no data
ECC memory support	-	+

Graphics specifications

General parameters of integrated GPUs, if any.

Integrated graphics card	Intel HD Graphics 4000	no data
Quick Sync Video	+	no data
Clear Video HD	+	no data
Graphics max frequency	1.1 GHz	no data
InTru 3D	+	no data

Graphics interfaces

Available interfaces and connections of Core i3-3120M and Xeon Gold 5318S integrated GPUs.

Number of displays supported	3	no data
eDP	+	no data
DisplayPort	+	no data
HDMI	+	no data
SDVO	+	no data
CRT	+	no data

Peripherals

Specifications and connection of peripherals supported by Core i3-3120M and Xeon Gold 5318S.

PCIe version	2.0	4.0
PCI Express lanes	16	64

Pros & cons summary

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Recency	30 September 2012	6 April 2021
Physical cores	2	24
Threads	4	48
Chip lithography	22 nm	10 nm
Power consumption (TDP)	35 Watt	165 Watt

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