Xeon Platinum 8358P vs i3-2370M

Primary details

Comparing Core i3-2370M and Xeon Platinum 8358P processor market type (desktop or notebook), architecture, sales start time and price.

Place in the ranking	2553	not rated
Place by popularity	not in top-100	not in top-100
Market segment	Laptop	Server
Series	Intel Core i3	no data
Power efficiency	2.33	no data
Architecture codename	Sandy Bridge (2011−2013)	Ice Lake-SP (2021)
Release date	1 January 2012 (12 years ago)	6 April 2021 (3 years ago)
Launch price (MSRP)	$225	no data

Detailed specifications

Core i3-2370M and Xeon Platinum 8358P basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.

Physical cores	2 (Dual-core)	32 (Dotriaconta-Core)
Threads	4	64
Base clock speed	2.4 GHz	2.6 GHz
Boost clock speed	2.4 GHz	3.4 GHz
Bus type	DMI 2.0	no data
Bus rate	4 × 5 GT/s	no data
Multiplier	24	no data
L1 cache	64K (per core)	64K (per core)
L2 cache	256K (per core)	1 MB (per core)
L3 cache	3 MB (shared)	48 MB (shared)
Chip lithography	32 nm	10 nm
Die size	149 mm2	no data
Maximum core temperature	85C (PGA); 100C (BGA)	no data
Maximum case temperature (TCase)	no data	80 °C
Number of transistors	624 million	no data
64 bit support	+	+
Windows 11 compatibility	-	+

Compatibility

Information on Core i3-2370M and Xeon Platinum 8358P compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.

Number of CPUs in a configuration	1 (Uniprocessor)	2
Socket	PPGA988	FCLGA4189
Power consumption (TDP)	35 Watt	240 Watt

Technologies and extensions

Technological solutions and additional instructions supported by Core i3-2370M and Xeon Platinum 8358P. You'll probably need this information if you require some particular technology.

Instruction set extensions	Intel® AVX	Intel® SSE4.2, Intel® AVX, Intel® AVX2, Intel® AVX-512
AES-NI	-	+
FMA	+	-
AVX	+	+
vPro	no data	+
Enhanced SpeedStep (EIST)	+	+
Speed Shift	no data	+
My WiFi	+	no data
Turbo Boost Technology	-	2.0
Hyper-Threading Technology	+	+
TSX	-	+
Idle States	+	no data
Thermal Monitoring	+	-
Flex Memory Access	+	no data
Demand Based Switching	-	no data
FDI	+	no data
Fast Memory Access	+	no data
Deep Learning Boost	-	+

Security technologies

Core i3-2370M and Xeon Platinum 8358P technologies aimed at improving security, for example, by protecting against hacks.

TXT	-	+
EDB	+	+
Identity Protection	+	-
SGX	no data	Yes with Intel® SPS
Anti-Theft	+	no data

Virtualization technologies

Virtual machine speed-up technologies supported by Core i3-2370M and Xeon Platinum 8358P are enumerated here.

AMD-V	+	-
VT-d	-	+
VT-x	+	+
EPT	+	+

Memory specs

Types, maximum amount and channel quantity of RAM supported by Core i3-2370M and Xeon Platinum 8358P. Depending on the motherboard, higher memory frequencies may be supported.

Supported memory types	DDR3	DDR4-3200
Maximum memory size	16 GB	6 TB
Max memory channels	2	8
Maximum memory bandwidth	21.335 GB/s	no data
ECC memory support	-	+

Graphics specifications

General parameters of integrated GPUs, if any.

Integrated graphics card	Intel HD Graphics 3000	no data
Quick Sync Video	+	-
Clear Video HD	+	no data
Graphics max frequency	1.15 GHz	no data
InTru 3D	+	no data

Graphics interfaces

Available interfaces and connections of Core i3-2370M and Xeon Platinum 8358P integrated GPUs.

Number of displays supported	2	no data
eDP	+	no data
DisplayPort	+	-
HDMI	+	-
SDVO	+	no data
CRT	+	no data

Peripherals

Specifications and connection of peripherals supported by Core i3-2370M and Xeon Platinum 8358P.

PCIe version	2.0	4.0
PCI Express lanes	16	64

Pros & cons summary

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Recency	1 January 2012	6 April 2021
Physical cores	2	32
Threads	4	64
Chip lithography	32 nm	10 nm
Power consumption (TDP)	35 Watt	240 Watt

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