Ryzen Embedded 5900E vs i3-2370LM

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Primary details

Comparing processor market type (desktop or notebook), architecture, sales start time and price.

Place in the rankingnot ratednot rated
Place by popularitynot in top-100not in top-100
Market segmentLaptopDesktop processor
SeriesIntel Core i3no data
DesignerIntelAMD
Manufacturerno dataTSMC
Architecture codenameSandy Bridge (2011−2013)Vermeer (2020−2025)
Release dateno data20 April 2023 (3 years ago)

Detailed specifications

Basic parameters of Core i3-2370LM and Ryzen Embedded 5900E: number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.

Physical cores2 (Dual-core)12 (Dodeca-Core)
Threads424
Base clock speedno data3.35 GHz
Boost clock speed1.7 GHz3.7 GHz
Bus typeDMI 2.0no data
Bus rate4 × 5 GT/sno data
Multiplier17no data
L1 cache128 KB64K (per core)
L2 cache512 KB512K (per core)
L3 cache3 MB64 MB (shared)
Chip lithography32 nm7 nm
Die size149 mm22x 74 mm2
Number of transistors624 Million8,300 million
64 bit support++
Windows 11 compatibility-no data

Compatibility

Information on Core i3-2370LM and Ryzen Embedded 5900E compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.

Number of CPUs in a configuration1 (Uniprocessor)1
Socketno dataAM4
Power consumption (TDP)17 Watt105 Watt

Technologies and extensions

Technological solutions and additional instructions supported by Core i3-2370LM and Ryzen Embedded 5900E. You'll probably need this information if you require some particular technology.

AES-NI-+
FMA+-
AVX++
Enhanced SpeedStep (EIST)+no data
Precision Boost 2no data+

Virtualization technologies

Virtual machine speed-up technologies supported by Core i3-2370LM and Ryzen Embedded 5900E are enumerated here.

AMD-V-+
VT-x+no data

Memory specs

Types, maximum amount and channel quantity of RAM supported by Core i3-2370LM and Ryzen Embedded 5900E. Depending on the motherboard, higher memory frequencies may be supported.

Supported memory typesDDR3-1333DDR4-3200
Maximum memory size16 GBno data
Max memory channels2no data
Maximum memory bandwidth21.335 GB/sno data

Graphics specifications

General parameters of integrated GPUs, if any.

Integrated graphics cardIntel HD Graphics 3000no data

Peripherals

Specifications and connection of peripherals supported by Core i3-2370LM and Ryzen Embedded 5900E.

PCIe versionno data4.0
PCI Express lanesno data24

Pros & cons summary


Physical cores 2 12
Threads 4 24
Chip lithography 32 nm 7 nm
Power consumption (TDP) 17 Watt 105 Watt

i3-2370LM has 518% lower power consumption.

Ryzen Embedded 5900E, on the other hand, has 500% more physical cores and 500% more threads, and a 357% more advanced lithography process.

We couldn't decide between Intel Core i3-2370LM and AMD Ryzen Embedded 5900E. We've got no test results to judge.

Be aware that Core i3-2370LM is a notebook processor while Ryzen Embedded 5900E is a desktop one.

Other comparisons

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Community ratings

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