Mobile Sempron 3600+ vs i3-2100
Primary details
Comparing Core i3-2100 and Mobile Sempron 3600+ processor market type (desktop or notebook), architecture, sales start time and price.
| Place in the ranking | 2353 | not rated |
| Place by popularity | 100 | not in top-100 |
| Cost-effectiveness evaluation | 0.28 | no data |
| Market segment | Desktop processor | Laptop |
| Series | no data | Mobile Sempron |
| Power efficiency | 1.70 | no data |
| Architecture codename | Sandy Bridge (2011−2013) | Sherman (2009) |
| Release date | 20 February 2011 (13 years ago) | no data (2024 years ago) |
| Launch price (MSRP) | $73 | no data |
Cost-effectiveness evaluation
Performance per price, higher is better.
Detailed specifications
Core i3-2100 and Mobile Sempron 3600+ basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
| Physical cores | 2 (Dual-core) | 1 (Single-Core) |
| Threads | 4 | 1 |
| Base clock speed | 3.1 GHz | no data |
| Boost clock speed | 3.1 GHz | 2 GHz |
| Bus rate | 5 GT/s | 800 MHz |
| L1 cache | 64 KB (per core) | no data |
| L2 cache | 256 KB (per core) | no data |
| L3 cache | 3 MB (shared) | no data |
| Chip lithography | 32 nm | 65 nm |
| Die size | 131 mm2 | no data |
| Maximum core temperature | 69 °C | no data |
| Number of transistors | 504 million | no data |
| 64 bit support | + | + |
| Windows 11 compatibility | - | - |
Compatibility
Information on Core i3-2100 and Mobile Sempron 3600+ compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
| Number of CPUs in a configuration | 1 | no data |
| Socket | FCLGA1155 | no data |
| Power consumption (TDP) | 65 Watt | 25 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by Core i3-2100 and Mobile Sempron 3600+. You'll probably need this information if you require some particular technology.
| Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX | no data |
| Enhanced SpeedStep (EIST) | + | no data |
| Turbo Boost Technology | - | no data |
| Hyper-Threading Technology | + | no data |
| Idle States | + | no data |
| Thermal Monitoring | + | - |
| Flex Memory Access | + | no data |
| FDI | + | no data |
| Fast Memory Access | + | no data |
Security technologies
Core i3-2100 and Mobile Sempron 3600+ technologies aimed at improving security, for example, by protecting against hacks.
| TXT | + | no data |
| EDB | + | no data |
| Identity Protection | + | - |
Virtualization technologies
Virtual machine speed-up technologies supported by Core i3-2100 and Mobile Sempron 3600+ are enumerated here.
| VT-d | - | no data |
| VT-x | + | no data |
| EPT | + | no data |
Memory specs
Types, maximum amount and channel quantity of RAM supported by Core i3-2100 and Mobile Sempron 3600+. Depending on the motherboard, higher memory frequencies may be supported.
| Supported memory types | DDR3 | no data |
| Maximum memory size | 32 GB | no data |
| Max memory channels | 2 | no data |
| Maximum memory bandwidth | 21 GB/s | no data |
Graphics specifications
General parameters of integrated GPUs, if any.
| Integrated graphics card | Intel HD Graphics 2000 | no data |
| Quick Sync Video | + | - |
| Clear Video HD | + | no data |
| Graphics max frequency | 1.1 GHz | no data |
| InTru 3D | + | no data |
Graphics interfaces
Available interfaces and connections of Core i3-2100 and Mobile Sempron 3600+ integrated GPUs.
| Number of displays supported | 2 | no data |
Peripherals
Specifications and connection of peripherals supported by Core i3-2100 and Mobile Sempron 3600+.
| PCIe version | 2.0 | no data |
| PCI Express lanes | 16 | no data |
Synthetic benchmark performance
Various benchmark results of the processors in comparison. Overall score is measured in points in 0-100 range, higher is better.
Passmark
Passmark CPU Mark is a widespread benchmark, consisting of 8 different types of workload, including integer and floating point math, extended instructions, compression, encryption and physics calculation. There is also one separate single-threaded scenario measuring single-core performance.
Pros & cons summary
| Physical cores | 2 | 1 |
| Threads | 4 | 1 |
| Chip lithography | 32 nm | 65 nm |
| Power consumption (TDP) | 65 Watt | 25 Watt |
i3-2100 has 100% more physical cores and 300% more threads, and a 103.1% more advanced lithography process.
Mobile Sempron 3600+, on the other hand, has 160% lower power consumption.
We couldn't decide between Core i3-2100 and Mobile Sempron 3600+. We've got no test results to judge.
Note that Core i3-2100 is a desktop processor while Mobile Sempron 3600+ is a notebook one.
Should you still have questions on choice between Core i3-2100 and Mobile Sempron 3600+, ask them in Comments section, and we shall answer.
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