Ryzen AI 9 HX PRO 375 vs Ultra 5 225F
Primary details
Comparing Core Ultra 5 225F and Ryzen AI 9 HX PRO 375 processor market type (desktop or notebook), architecture, sales start time and price.
| Place in the ranking | not rated | not rated |
| Place by popularity | not in top-100 | not in top-100 |
| Market segment | Desktop processor | Laptop |
| Architecture codename | Arrow Lake-S (2024−2025) | Strix Point (2024−2025) |
| Release date | January 2025 (recently) | January 2025 (recently) |
Detailed specifications
Core Ultra 5 225F and Ryzen AI 9 HX PRO 375 basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
| Physical cores | 10 (Deca-Core) | 12 (Dodeca-Core) |
| Threads | 10 | 24 |
| Base clock speed | 3.3 GHz | 2 GHz |
| Boost clock speed | 4.9 GHz | 5.1 GHz |
| L1 cache | 112 KB (per core) | 80 KB (per core) |
| L2 cache | 3 MB (per core) | 1 MB (per core) |
| L3 cache | 21 MB (shared) | 16 MB |
| Chip lithography | 3 nm | 4 nm |
| Die size | 243 mm2 | no data |
| Number of transistors | 17,800 million | no data |
| 64 bit support | + | + |
Compatibility
Information on Core Ultra 5 225F and Ryzen AI 9 HX PRO 375 compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
| Number of CPUs in a configuration | 1 | 1 |
| Socket | 1851 | FP8 |
| Power consumption (TDP) | 65 Watt | 28 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by Core Ultra 5 225F and Ryzen AI 9 HX PRO 375. You'll probably need this information if you require some particular technology.
| AES-NI | + | + |
| AVX | + | + |
| Enhanced SpeedStep (EIST) | + | no data |
| TSX | + | - |
| Precision Boost 2 | no data | + |
Security technologies
Core Ultra 5 225F and Ryzen AI 9 HX PRO 375 technologies aimed at improving security, for example, by protecting against hacks.
| TXT | + | no data |
Virtualization technologies
Virtual machine speed-up technologies supported by Core Ultra 5 225F and Ryzen AI 9 HX PRO 375 are enumerated here.
| AMD-V | - | + |
| VT-d | + | no data |
| VT-x | + | no data |
Memory specs
Types, maximum amount and channel quantity of RAM supported by Core Ultra 5 225F and Ryzen AI 9 HX PRO 375. Depending on the motherboard, higher memory frequencies may be supported.
| Supported memory types | DDR5 | DDR5 |
Graphics specifications
General parameters of integrated GPUs, if any.
| Integrated graphics card | N/A | AMD Radeon 890M |
Peripherals
Specifications and connection of peripherals supported by Core Ultra 5 225F and Ryzen AI 9 HX PRO 375.
| PCIe version | 5.0 | 4.0 |
| PCI Express lanes | 20 | 16 |
Pros & cons summary
| Physical cores | 10 | 12 |
| Threads | 10 | 24 |
| Chip lithography | 3 nm | 4 nm |
| Power consumption (TDP) | 65 Watt | 28 Watt |
Ultra 5 225F has a 33.3% more advanced lithography process.
Ryzen AI 9 HX PRO 375, on the other hand, has 20% more physical cores and 140% more threads, and 132.1% lower power consumption.
We couldn't decide between Core Ultra 5 225F and Ryzen AI 9 HX PRO 375. We've got no test results to judge.
Note that Core Ultra 5 225F is a desktop processor while Ryzen AI 9 HX PRO 375 is a notebook one.
Should you still have questions on choice between Core Ultra 5 225F and Ryzen AI 9 HX PRO 375, ask them in Comments section, and we shall answer.
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