Mobile Pentium III 500 ULV vs Core 2 Duo T5870
Primary details
Comparing Core 2 Duo T5870 and Mobile Pentium III 500 ULV processor market type (desktop or notebook), architecture, sales start time and price.
Place in the ranking | 3017 | not rated |
Place by popularity | not in top-100 | not in top-100 |
Market segment | Laptop | Laptop |
Series | Intel Core 2 Duo | no data |
Power efficiency | 1.23 | no data |
Designer | Intel | Intel |
Architecture codename | Merom (2006−2008) | Coppermine (1999−2001) |
Release date | 1 October 2008 (16 years ago) | 30 January 2001 (24 years ago) |
Launch price (MSRP) | no data | $208 |
Detailed specifications
Core 2 Duo T5870 and Mobile Pentium III 500 ULV basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
Physical cores | 2 (Dual-core) | 1 (Single-Core) |
Threads | 2 | 1 |
Base clock speed | 2 GHz | no data |
Boost clock speed | 2 GHz | 0.5 GHz |
Bus rate | 800 MHz | no data |
L1 cache | no data | 32 KB |
L2 cache | 2 MB | 256 KB |
L3 cache | 2 MB L2 Cache | no data |
Chip lithography | 65 nm | 180 nm |
Die size | 143 mm2 | 106 mm2 |
Maximum core temperature | 100 °C | no data |
Number of transistors | 291 Million | 28 million |
64 bit support | + | - |
Windows 11 compatibility | - | no data |
VID voltage range | 1.075V-1.175V | no data |
Compatibility
Information on Core 2 Duo T5870 and Mobile Pentium III 500 ULV compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
Number of CPUs in a configuration | no data | 1 |
Socket | no data | Intel Micro-BGA2 |
Power consumption (TDP) | 35 Watt | 5 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by Core 2 Duo T5870 and Mobile Pentium III 500 ULV. You'll probably need this information if you require some particular technology.
Enhanced SpeedStep (EIST) | + | + |
Turbo Boost Technology | - | no data |
Hyper-Threading Technology | - | no data |
Demand Based Switching | - | no data |
FSB parity | - | no data |
Security technologies
Core 2 Duo T5870 and Mobile Pentium III 500 ULV technologies aimed at improving security, for example, by protecting against hacks.
TXT | - | no data |
EDB | + | no data |
Virtualization technologies
Virtual machine speed-up technologies supported by Core 2 Duo T5870 and Mobile Pentium III 500 ULV are enumerated here.
VT-x | - | no data |
Graphics specifications
General parameters of integrated GPUs, if any.
Integrated graphics card | no data | On certain motherboards (Chipset feature) |
Pros & cons summary
Recency | 1 October 2008 | 30 January 2001 |
Physical cores | 2 | 1 |
Threads | 2 | 1 |
Chip lithography | 65 nm | 180 nm |
Power consumption (TDP) | 35 Watt | 5 Watt |
Core 2 Duo T5870 has an age advantage of 7 years, 100% more physical cores and 100% more threads, and a 176.9% more advanced lithography process.
Mobile Pentium III 500 ULV, on the other hand, has 600% lower power consumption.
We couldn't decide between Intel Core 2 Duo T5870 and Intel Mobile Pentium III 500 ULV. We've got no test results to judge.
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