E2-3000 vs Celeron B810

Primary details

Comparing Celeron B810 and E2-3000 processor market type (desktop or notebook), architecture, sales start time and price.

Place in the ranking	not rated	not rated
Place by popularity	not in top-100	not in top-100
Market segment	Laptop	Laptop
Series	Intel Celeron	AMD E-Series
Architecture codename	Sandy Bridge (2011−2013)	Kabini (2013−2014)
Release date	1 March 2011 (13 years ago)	23 May 2013 (11 years ago)
Launch price (MSRP)	$86	no data

Detailed specifications

Celeron B810 and E2-3000 basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.

Physical cores	2 (Dual-core)	2 (Dual-core)
Threads	2	2
Base clock speed	1.6 GHz	no data
Boost clock speed	1.6 GHz	1.65 GHz
Bus type	DMI 2.0	no data
Bus rate	4 × 5 GT/s	no data
Multiplier	16	no data
L1 cache	64K (per core)	no data
L2 cache	256K (per core)	1024 KB
L3 cache	2 MB (shared)	0 KB
Chip lithography	32 nm	28 nm
Die size	131 mm2	246 mm2
Maximum core temperature	100 °C	no data
Maximum case temperature (TCase)	no data	90 °C
Number of transistors	504 million	1,178 million
64 bit support	+	+
Windows 11 compatibility	-	-

Compatibility

Information on Celeron B810 and E2-3000 compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.

Number of CPUs in a configuration	1 (Uniprocessor)	1
Socket	PGA988	FT3
Power consumption (TDP)	35 Watt	15 Watt

Technologies and extensions

Technological solutions and additional instructions supported by Celeron B810 and E2-3000. You'll probably need this information if you require some particular technology.

Instruction set extensions	Intel® SSE4.1, Intel® SSE4.2	86x SSE (1, 2, 3, 3S, 4.1, 4.2, 4A),-64, AES, AVX
AES-NI	-	+
FMA	+	FMA4
AVX	-	+
PowerNow	-	+
PowerGating	-	+
VirusProtect	-	+
Enhanced SpeedStep (EIST)	+	no data
My WiFi	-	no data
Turbo Boost Technology	-	no data
Hyper-Threading Technology	-	no data
Idle States	+	no data
Thermal Monitoring	+	-
Flex Memory Access	+	no data
Demand Based Switching	-	no data
FDI	+	no data
Fast Memory Access	+	no data

Security technologies

Celeron B810 and E2-3000 technologies aimed at improving security, for example, by protecting against hacks.

TXT	-	no data
EDB	+	no data
Anti-Theft	-	no data

Virtualization technologies

Virtual machine speed-up technologies supported by Celeron B810 and E2-3000 are enumerated here.

AMD-V	-	+
VT-d	-	no data
VT-x	+	no data
IOMMU 2.0	-	+

Memory specs

Types, maximum amount and channel quantity of RAM supported by Celeron B810 and E2-3000. Depending on the motherboard, higher memory frequencies may be supported.

Supported memory types	DDR3	DDR3
Maximum memory size	16.6 GB	no data
Max memory channels	2	1
Maximum memory bandwidth	21.335 GB/s	no data

Graphics specifications

General parameters of integrated GPUs, if any.

Integrated graphics card	Intel® HD Graphics for 2nd Generation Intel® Processors	AMD Radeon HD 8280
Enduro	-	+
Switchable graphics	-	+
UVD	-	+
VCE	-	+
Graphics max frequency	950 MHz	no data

Graphics interfaces

Available interfaces and connections of Celeron B810 and E2-3000 integrated GPUs.

Number of displays supported	2	no data
eDP	+	no data
DisplayPort	+	+
HDMI	+	+
SDVO	+	no data
CRT	+	no data

Graphics API support

APIs supported by Celeron B810 and E2-3000 integrated GPUs, sometimes API versions are included.

DirectX	no data	DirectX® 12
Vulkan	-	+

Peripherals

Specifications and connection of peripherals supported by Celeron B810 and E2-3000.

PCIe version	2.0	2.0
PCI Express lanes	16	no data

Synthetic benchmark performance

Various benchmark results of the processors in comparison. Overall score is measured in points in 0-100 range, higher is better.

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Pros & cons summary

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Recency	1 March 2011	23 May 2013
Chip lithography	32 nm	28 nm
Power consumption (TDP)	35 Watt	15 Watt

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