Mobile Sempron SI-40 vs Celeron 3215U

General info

Comparing Celeron 3215U and Mobile Sempron SI-40 processor market type (desktop or notebook), architecture, sales start time and price.

Place in performance ranking	2550	not rated
Place by popularity	not in top-100	not in top-100
Market segment	Laptop	Laptop
Series	Intel Celeron	AMD Mobile Sempron
Architecture codename	Broadwell (2015−2019)	Sable (2008−2009)
Release date	1 June 2015 (8 years old)	4 July 2008 (15 years old)
Launch price (MSRP)	$107	no data
Current price	$256 (2.4x MSRP)	$7.54

Technical specs

Celeron 3215U and Mobile Sempron SI-40 basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.

Physical cores	2 (Dual-core)	1 (Single-Core)
Threads	2	1
Base clock speed	1.7 GHz	no data
Boost clock speed	1.7 GHz	2 GHz
Bus support	no data	1800 MHz
L1 cache	128 KB	no data
L2 cache	512 KB	512 KB
L3 cache	2 MB	no data
Chip lithography	14 nm	65 nm
Die size	82 mm2	no data
Maximum core temperature	105 °C	100 °C
Number of transistors	1300 Million	no data
64 bit support	+	+
Windows 11 compatibility	-	-
Unlocked multiplier	No	No

Compatibility

Information on Celeron 3215U and Mobile Sempron SI-40 compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.

Number of CPUs in a configuration	1	no data
Socket	FCBGA1168	S1g2
Power consumption (TDP)	15 Watt	25 Watt

Technologies and extensions

Technological solutions and additional instructions supported by Celeron 3215U and Mobile Sempron SI-40. You'll probably need this information if you require some particular technology.

Instruction set extensions	Intel® SSE4.1, Intel® SSE4.2	65 nm, 1.075 - 1.125V
AES-NI	+	no data
AVX	+	no data
Enhanced SpeedStep (EIST)	+	no data
Turbo Boost Technology	-	no data
Hyper-Threading Technology	-	no data
TSX	-	no data
Thermal Monitoring	+	no data
Flex Memory Access	+	no data
Smart Response	-	no data
FDI	+	no data
Fast Memory Access	+	no data
Status	Discontinued	no data

Security technologies

Celeron 3215U and Mobile Sempron SI-40 technologies aimed at improving security, for example, by protecting against hacks.

TXT	-	no data
EDB	+	no data
Secure Key	+	no data
Identity Protection	+	no data
OS Guard	-	no data

Virtualization technologies

Virtual machine speed-up technologies supported by Celeron 3215U and Mobile Sempron SI-40 are enumerated here.

AMD-V	+	no data
VT-d	+	no data
VT-x	+	no data
EPT	+	no data

Memory specs

Types, maximum amount and channel quantity of RAM supported by Celeron 3215U and Mobile Sempron SI-40. Depending on the motherboard, higher memory frequencies may be supported.

Supported memory types	DDR3	no data
Maximum memory size	16 GB	no data
Max memory channels	2	no data
Maximum memory bandwidth	25.6 GB/s	no data

Graphics specifications

General parameters of integrated GPUs, if any.

Integrated graphics card	Intel® HD Graphics for 5th Generation Intel® Processors	no data
Quick Sync Video	+	no data
Clear Video	+	no data
Graphics max frequency	850 MHz	no data
InTru 3D	+	no data

Graphics interfaces

Available interfaces and connections of Celeron 3215U and Mobile Sempron SI-40 integrated GPUs.

Number of displays supported	3	no data
eDP	+	no data
DisplayPort	+	no data
HDMI	+	no data

Graphics API support

APIs supported by Celeron 3215U and Mobile Sempron SI-40 integrated GPUs, sometimes API versions are included.

DirectX

11.2/12

no data

Peripherals

Specifications and connection of peripherals supported by Celeron 3215U and Mobile Sempron SI-40.

PCIe version	2.0	no data
PCI Express lanes	12	no data

Advantages and disadvantages

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Recency	1 June 2015	4 July 2008
Physical cores	2	1
Threads	2	1
Chip lithography	14 nm	65 nm
Power consumption (TDP)	15 Watt	25 Watt

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