E-350 vs Celeron 1007U

Primary details

Comparing Celeron 1007U and E-350 processor market type (desktop or notebook), architecture, sales start time and price.

Place in performance ranking	2742	not rated
Place by popularity	not in top-100	not in top-100
Market segment	Laptop	Laptop
Series	Intel Celeron	AMD E-Series
Architecture codename	Ivy Bridge (2012−2013)	Zacate (2011−2013)
Release date	20 January 2013 (11 years ago)	4 January 2011 (13 years ago)
Launch price (MSRP)	$86	no data
Current price	$205 (2.4x MSRP)	$268

Detailed specifications

Celeron 1007U and E-350 basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.

Physical cores	2 (Dual-core)	2 (Dual-core)
Threads	2	2
Base clock speed	1.5 GHz	no data
Boost clock speed	1.5 GHz	1.6 GHz
L1 cache	64K (per core)	64K (per core)
L2 cache	256K (per core)	512K (per core)
L3 cache	2 MB (shared)	0 KB
Chip lithography	22 nm	40 nm
Die size	118 mm2	75 mm2
Maximum core temperature	105 °C	90 °C
Maximum case temperature (TCase)	105 °C	no data
Number of transistors	1,400 million	no data
64 bit support	+	+
Windows 11 compatibility	-	-
Unlocked multiplier	No	No

Compatibility

Information on Celeron 1007U and E-350 compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.

Number of CPUs in a configuration	1	1
Socket	FCBGA1023	FT1
Power consumption (TDP)	17 Watt	18 Watt

Technologies and extensions

Technological solutions and additional instructions supported by Celeron 1007U and E-350. You'll probably need this information if you require some particular technology.

Instruction set extensions	Intel® SSE4.1, Intel® SSE4.2	DDR3-1066/DDR3L-1066 RAM, PCIe 2 [?], MMX (+), SSE, SSE2, SSE3, SSSE3, SSE4A
AES-NI	-	no data
Enhanced SpeedStep (EIST)	+	no data
My WiFi	-	no data
Turbo Boost Technology	-	no data
Hyper-Threading Technology	-	no data
Idle States	+	no data
Thermal Monitoring	+	no data
Flex Memory Access	+	no data
Demand Based Switching	-	no data
FDI	+	no data
Fast Memory Access	+	no data
Status	Discontinued	no data

Security technologies

Celeron 1007U and E-350 technologies aimed at improving security, for example, by protecting against hacks.

TXT	-	no data
EDB	+	no data
Anti-Theft	-	no data

Virtualization technologies

Virtual machine speed-up technologies supported by Celeron 1007U and E-350 are enumerated here.

AMD-V	no data	+
VT-d	-	no data
VT-x	+	no data
EPT	+	no data

Memory specs

Types, maximum amount and channel quantity of RAM supported by Celeron 1007U and E-350. Depending on the motherboard, higher memory frequencies may be supported.

Supported memory types	DDR3	DDR3
Maximum memory size	32 GB	no data
Max memory channels	2	no data
Maximum memory bandwidth	25.6 GB/s	no data
ECC memory support	-	no data

Graphics specifications

General parameters of integrated GPUs, if any.

Integrated graphics card	Intel® HD Graphics for 3rd Generation Intel® Processors	AMD Radeon HD 6310
Graphics max frequency	1 GHz	no data

Graphics interfaces

Available interfaces and connections of Celeron 1007U and E-350 integrated GPUs.

Number of displays supported	3	no data
eDP	+	no data
DisplayPort	+	no data
HDMI	+	no data
SDVO	+	no data
CRT	+	no data

Peripherals

Specifications and connection of peripherals supported by Celeron 1007U and E-350.

PCIe version	2.0	no data
PCI Express lanes	16	no data

Synthetic benchmark performance

Various benchmark results of the processors in comparison. Overall score is measured in points in 0-100 range, higher is better.

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Pros & cons summary

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Recency	20 January 2013	4 January 2011
Chip lithography	22 nm	40 nm
Power consumption (TDP)	17 Watt	18 Watt

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